University of California, Riverside

Department of Electrical and Computer Engineering

Through-Silicon-Via Devices and Circuits: Towards Submilimeter Sensing for Geo-Data Mining

Through-Silicon-Via Devices and Circuits: Towards Submilimeter Sensing for Geo-Data....

Through-Silicon-Via Devices and Circuits: Towards Submilimeter Sensing for Geo-Data Mining

February 27, 2015 - 2:00 pm
Bourns Hall, A265


Big Data is becoming an integral part of every sector in the global economy, enhancing the quality and efficiency of human capital operations. Yet in some sectors, critical data is never easy to collect. In this talk, I will first demonstrate some unprecedented challenges on the design of submillimeter sensors needed in geo-data mining, which are of critical importance to applications such as geothermal utilization and structural safety. The functional complexity and tight area budget are hard to satisfy using any existing design schemes. I will then show that a novel framework, derived from three-dimensional integrated systems, may come to rescue. It is based on our interesting discovery that idle through-silicon-vias (TSVs) can in fact be made as ultra-compact devices. An example will be given on the TSV inductor and its application to area-hungry DC-DC converters. Experiments on product-level designs verify that significant area reduction can be achieved with almost no loss in performance. Finally, I will briefly discuss my other research directions, including sensor-guided low power computing, stochastic circuit design for hardware security, and smart grid security. 


Yiyu Shi received his B.S. degree (with honors) in Electronic Engineering from Tsinghua University, Beijing, China in 2005, the M.S and Ph.D. degree in Electrical Engineering from the University of California, Los Angeles in 2007 and 2009 respectively. He joined the faculty of Electrical and Computer Engineering Department at Missouri University of Science and Technology in Sept. 2010, where he is the co-founder and site associate director of NSF I/UCRC Net-Centric Software and Systems Center. His current research interests include three-dimensional integrated circuits, embedded computing towards low power and security (SW/HW) and renewable energy applications. Since 2011 he has attracted more than 1.4 million (personal portion only) federal and industry research funding. In recognition of his research, six of his papers have been nominated for the Best Paper Award and one paper has received the Best Paper in Track, all in top conferences (DAC'05, ICCAD'07, ICCD'08, ASPDAC'09, DAC'09, ISPD'13, ICCAD'14). He was also the recipient of IBM Invention Achievement Award (2009), Japan Society for the Promotion of Science (JSPS) Faculty Invitation Fellowship, Humboldt Research Fellowship for Experienced Researchers, Carl Friedrich von Siemens Research Fellowship, Missouri S&T Faculty Excellence Award, the Academy of Science (St. Louis) Innovation Award, IEEE St. Louis Section Outstanding Educator Award, and National Science Foundation CAREER Award (all in 2014)). He has served on the technical program committee of many international conferences including DAC, ICCAD, ISPD, ASPDAC and ICCD. He is a senior member of IEEE.

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