Publication

Export 283 results:
Author Title Type [ Year(Asc)]
2017
Y. Yao, Kim, T., Chen, H., Wang, H., Tlelo-Cuautle, E., and Tan, S. X. - D., Comprehensive detection of counterfeit ICs via on-chip sensor and post-fabrication authentication policy, in International Conference on Synthesis, Modeling, Analysis and Simulation Methods and Applications to Circuit Design (SMACD’17) , Giardini Naxos - Taormina, Italy, 2017.
J. Peng, Chen, H., Zhao, H., Sun, Z., and Tan, S. X. - D., Dynamic Temperature-Aware Reliability Modeling for Multi-Branch Interconnect Trees, in International Conference on ASIC (ASICON’17), Guiyang, China, 2017.
T. Kim, Sun, Z., Chen, H., Wang, H., and Tan, S. X. -.D., Energy and lifetime optimizations for dark silicon manycore microprocessor considering both hard and soft errors, IEEE Transactions on Very Large Scale Integrated Systems (TVLSI), vol. 25, no. 9, 2017.
X. Wang, Yan, Y., He, J., Tan, S. X. - D., Cook, C., and Yang, S., Fast physics-based electromigration analysis for multi-branch interconnect trees, in IEEE/ACM International Conf. on Computer-Aided Design (ICCAD’17), Irvine, CA, 2017.
W. He, Zhao, H., Qi, Z., Chen, H., and Tan, S. X. - D., Fast two-dimensional finite element analysis for power network DC integrity checks of PCBs, in International Conference on ASIC (ASICON’17), Guiyang, China, 2017.
X. Wang, Wang, H., He, J., Tan, S. X. - D., Cai, Y., and Yang, S., Physics-based electromigration modeling and assessment for multi-segment interconnects in power grid networks, in Design, Automation and Test in Europe (DATE'17), Lausanne, Switzerland, 2017.
S. Wang, Sun, Z., Cheng, Y., Tan, S. X. - D., and Tahoori, M., Physics-based TSV electromigratoin modeling and TSV repair for 3D power grid networks, in IEEE/ACM International Conf. on Computer-Aided Design (ICCAD’17), Irvine, CA, 2017.
A. D. Pano-Azucena, Tlelo-Cuautle, E., de la Fraga, L. G., Sánchez-López, C., Rangel-Magdaleno, J. J., and Tan, S. X. - D., Prediction of chaotic time-series with different MLE values using FPGA-based ANNs, in International Conference on Synthesis, Modeling, Analysis and Simulation Methods and Applications to Circuit Design (SMACD’17), Giardini Naxos - Taormina, Italy, 2017.
S. Wang, Zhao, H., Tan, S. X. - D., and Tahoori, M., Recovery-aware proactive TSV repair for electromigration in 3D ICs, in Design, Automation and Test in Europe (DATE'17), Lausenne, Switzerland, 2017.
2016
H. Chen, Tan, S. X. - D., Huang, X., Kim, T., and Sukharev, V., Analytical modeling and characterization of electromigration effects for multi-branch interconnect trees, IEEE Transaction on Computer-Aided Design of Integrated Circuits and Systems (TCAD), vol. 35, no. 11, 2016.
T. Kim, Sun, Z., Cook, C., Zhao, H., Li, R., Wong, D., and Tan, S. X. - D., Cross-layer modeling and optimization for electromigration induced reliability, Proc. IEEE/ACM Design Automation Conference (DAC’16), vol. (Invited). Austin, TX, 2016.
L. Xu, Wang, H., Tan, S. X. - D., Zhang, C., Yuan, Y., Huang, K., and Zhang, Z., Distributed model predictive control for dynamic thermal management of multi-core systems, in Int., Conf. Solid State and Integrated Circuit Technology (ICSICT’16), Hangzhou, China, 2016.
X. Huang, Sukharev, V., Kim, T., and Tan, S. X. - D., Dynamic electromigration modeling for transient stress evolution and recovery under time-dependent current and temperature stressing, Integration, the VLSI Journal, 2016.
T. Kim, Sun, Z., Gaddipati, J., Wang, H., Chen, H., and Tan, S. X. - D., Dynamic reliability management for near-threshold dark silicon processors, in IEEE/ACM International Conf. on Computer-Aided Design (ICCAD’16), Austin, TX, 2016.
X. Huang, Sukharev, V., Choy, J. - H., Chew, M., Kim, T., and Tan, S. X. - D., Electromigration Assessment for Power Grid Networks Considering Temperature and Thermal Stress Effects, Integration, the VLSI Journal, p. -, 2016.
X. Huang, Sukharev, V., Kim, T., Chen, H., and Tan, S. X. D., Electromigration recovery modeling and analysis under time-dependent current and temperature stressing, in 2016 21st Asia and South Pacific Design Automation Conference (ASP-DAC), 2016.
X. Chen, Chen, H., Ma, W., Li, X., and Tan, S. X. - D., Energy-efficient wireless temperature sensoring for smart building application, in Int, Conf. Solid State and Integrated Circuit Technology (ICSICT’16), Hangzhou, China, 2016.
J. Wan, Wang, H., He, J., Tan, S. X. - D., Cai, Y., and Yang, S., A fast full-chip static power estimation method, in Int., Conf. Solid State and Integrated Circuit Technology (ICSICT’16), Hangzhou, China, 2016.
L. Zhang, Wang, H., and Tan, S. X. - D., Fast stress analysis for runtime reliability enhancement of 3D IC using artificial neural networks, Proc. Int. Symposium on Quality Electronic Design (ISQED’16). 2016.
C. Cook, Sun, Z., Kim, T., and Tan, S. X. - D., Finite difference method for electromigration analysis of multi-branch interconnects, in nternational Conference on Synthesis, Modeling, Analysis and Simulation Methods and Applications to Circuit Design (SMACD), Lisbon, Portugal, 2016.
C. Cook, Sun, Z., Kim, T., and Tan, S. X. - D., Finite difference time domain analysis of stress evolution and void growth for general interconnect wires, in TECHCON'2016, Austin, TX, 2016.
H. Wang, Ma, J., Tan, S. X. - D., Zhang, C., Tang, H., and Huang, K., Hierarchical dynamic thermal management method for high-performance many-core microprocessors, ACM Transactions on Design Automation of Electronic Systems (TODAES), vol. 22, no. 1, 2016.
T. Kim, Huang, X., Chen, H., Sukharev, V., and Tan, S. X. - D., Learning-based dynamic reliability management for dark silicon processor considering EM effects, Proc. Design, Automation and Test in Europe (DATE'16). 2016.
H. Zhao, Qi, Z., Wang, S., Vafai, K., Wang, H., Chen, H., and Tan, S. X. - D., Learning-based occupancy behavioral detection for smart buildings, Proc. IEEE International Symposium on Circuits and Systems (ISCAS), vol. (Special Session). 2016.
H. Wang, Zhang, M., Tan, S. X. - D., Zhang, C., Yuan, Y., Huang, K., and Zhang, Z., New power budgeting and thermal management scheme for multi-core systems in dark silicon, in 29th IEEE International SoC Conference (SOCC’16), Seattle, WA , 2016.
H. Zhao, Tan, S. X. - D., Wang, H., and Chen, H., Online unusual behavior detection for temperature sensor networks, in 2016 IEEE Computer Society Annual Symposium on VLSI (ISVLSI’16), Pittsburg, PA, 2016.
X. Chen, Li, X., and Tan, S. X. - D., Overview of cyber-physical temperature estimation in smart buildings: from modeling to measurements, in IEEE INFOCOM Workshop on Cross-Layer Cyber Physical Systems Security (CPSS), 2016.
K. He, Tan, S. X. - D., Zhao, H., Liu, X. - X., Wang, H., and Shi, G., Parallel GMRES Solver for Fast Analysis of Large Linear Dynamic Systems on GPU Platforms, Integr. VLSI J., vol. 52, pp. 10–22, 2016.
X. Huang, Kteyan, A., Tan, X., and Sukharev, V., Physics-based Electromigration Models and Full-chip Assessment for Power Grid Networks, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, vol. PP, pp. 1-1, 2016.
X. Huang, Sukharev, V., Qi, Z., Kim, T., and Tan, S. X. - D., Physics-based full-chip TDDB assessment for BEOL Interconnects, Proc. IEEE/ACM Design Automation Conference (DAC’16). Austin, TX, 2016.
Y. Zhao, Kim, T., Shin, H., Tan, S. X. - D., Li, X., Chen, H., and Wang, H., Statistical rare event analysis and parameter guidance by elite learning sample selection, ACM Transactions on Design Automation of Electronic Systems (TODAES), vol. 21, no. 4, 2016.
W. Liu, Wang, H., Zhao, H., Wang, S., Chen, H., Fu, Y., Ma, J., Li, X., and Tan, S. X. D., Thermal modeling for energy-efficient smart building with advanced overfitting mitigation technique, in 2016 21st Asia and South Pacific Design Automation Conference (ASP-DAC), 2016.
Z. Sun, Demircan, E., Shroff, M., Kim, T., Huang, X., and Tan, S. X. - D., Voltage-based electromigration immortality check for general multi-branch interconnects, in Proc. IEEE/ACM International Conf. on Computer-Aided Design (ICCAD’16), Austin, TX, 2016.
2015
T. Kim, Huang, X., Sukharev, V., and X.D.-Tan, S., A dynamic reliability management framework for dark silicon, in TECHCON, 2015.
V. Sukharev, Huang, X., and Tan, S. X. - D., Electromigration induced stress evolution under alternate current and pulse current loads, Journal of Applied Physics, vol. 118, 2015.
K. He, Huang, X., and X.D.-Tan, S., EM-based on-chip aging sensor for detection and prevention of counterfeit and recycled ICs, in Proc. Int. Conf. on Computer Aided Design (ICCAD), 2015.
X. Chen, Li, X., and Tan, S. X. - D., From robust chip to smart building: CAD Algorithms and methodologies for Uncertainty Analysis of Building Performance, in IEEE/ACM International Conf. on Computer-Aided Design (ICCAD’15), Austin, TX, 2015.
X. Huang, Sukharev, V., Choy, J. - H., Chen, H., Tlelo-Cuautle, E., and Tan, S. X. D., Full-chip electromigration assessment: Effect of cross-layout temperature and thermal stress distributions, in Synthesis, Modeling, Analysis and Simulation Methods and Applications to Circuit Design (SMACD), 2015 International Conference on, 2015.
Y. Zhu and X.D.-Tan, S., GPU-accelerated parallel Monte Carlo analysis of analog circuits by hierarchical graph-based solver, in Proc. Asia South Pacific Design Automation Conf. (ASPDAC), 2015.
X. Liu, X.D.-Tan, S., and Yu, H., A GPU-accelerated parallel shooting algorithm for analysis of radio frequency and microwave integrated circuits, IEEE Trans. on Very Large Scale Integration (VLSI) Systems, vol. 23, 2015.
K. He, X.D.-Tan, S., Wang, H., and Shi, G., GPU-accelerated parallel sparse LU factorization method for fast circuit analysis, IEEE Trans. on Very Large Scale Integration (VLSI) Systems, 2015.
H. Chen, X.D.-Tan, S., Sukharev, V., Huang, X., and Kim, T., Interconnect reliability modeling and analysis for multi-branch interconnect trees, in Proc. Design Automation Conf. (DAC), 2015.
H. Zhao, QUach, D., Wang, S., Ma, J., Wang, H., Li, X., and X.D.-Tan, S., Learning based compact thermal modeling for energy-efficient smart building management, in Proc. Int. Conf. on Computer Aided Design (ICCAD), 2015.
T. Kim, Huang, X., Sukharev, V., and Tan, S. X. - D., Learning-based reliability management for dark silicon systems, in 6th IEEE International Workshop on Testing 3D Stacked ICs (3D-Test), Anaheim, CA, 2015.
H. Chen, Li, Y., X.D.-Tan, S., Huang, X., Wang, H., and Wong, N., $\mathcalH$-matrix based finite-element-based thermal analysis for 3D ICs, ACM Trans. on Design Automation of Electronics Systems, 2015.
H. Chen, X.D.-Tan, S., Huang, X., and Sukharev, V., New electromigration modeling and analysis considering time-varying temperature and current densities, in Proc. Asia South Pacific Design Automation Conf. (ASPDAC), 2015.
X. Liu, Zhai, K., Liu, Z., He, K., X.D.-Tan, S., and Yu, W., Parallel thermal analysis of 3D integrated circuits with liquid cooling on CPU-GPU platforms, IEEE Trans. on Very Large Scale Integration (VLSI) Systems, pp. 575–579, 2015.
H. Shin, X.D.-Tan, S., Shi, G., and Tledo-Cuautle, E., Rare Event Diagnosis by Iterative Failure Region Locating and Elite Learning Sample Collection, in Latin-American Test Symposium (LATS), 2015.

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