University of California, Riverside

Department of Electrical and Computer Engineering



NSF funded research for developing new physics-based electromigration reliability model and access techniques for reliability-aware design and management of integrated circuits.


NSF funded research for developing new physics-based electromigration reliability....
 
Tan

NSF funded research for developing new physics-based electromigration reliability model and access techniques for reliability-aware design and management of integrated circuits.

June 16, 2015

 

Professor Sheldon Tan (PI) received  a three-year grant (CCF- 1527324) from National Science for

 

developing new electromigration-induced reliability model and full-chip assessment techniques for more reliable and robust nanometer ICs. The project is titled “SHF:Small: Physics-Based Electromigration Assessment and Validation For Reliability-Aware Design and Management”. The project seeks to develop new physics-based electromigration models and full-chip assessment techniques, and to perform model validation for accurate yet efficient electromigration verification at the design stage and electromigration-aware reliability management at run time for nanometer IC chips.  More information about this new award can be found at http://www.nsf.gov/awardsearch/showAward?AWD_ID=1527324&HistoricalAwards=false

 

Long-term reliability has become a significant challenge for design of integrated circuits (ICs) chip used in today’s computers and smart phones. It was expected that the future chips will show a sign of reliability-induced age much faster than the previous generations. Among many reliability effects, electromigration-induced reliability has become a major design constraint due to aggressive transistor scaling and increasing power density. In this project, the PI proposes to address challenging IC reliability problems by providing more accurate electromigration models and assessment techniques at the both the circuit level and the system level (such as operational system) so that electromigraton induced reliability and aging effects can be fully accounted, leveraged and optimized at both the design stage and run time to improve the chip’s reliability and their lifetime at minimum design costs. Furthermore, through the collaborations with the industry partners, the proposed techniques will bring immediate impacts on the design and tool development community to improve design productivity. This grant will also enable the PI to hire more female and underrepresented minority students to further contribute to the diversity in America’s science and technology workforce.

 

The UCR team will work closely with industry collaborators from Mentor Graphics Corp. (Dr. V. Sukharev) and Fraunhofer Institute for Ceramic Technologies and Systems (IKTS, Dresden, Germany,  Dr. E. Zschech) to validate the proposed EM models against the  measurement on real silicon.

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